Gembird's TG-G3.0-01 thermal paste provides efficient thermal conductivity with a value of 4.5 W/mK. This product ensures optimal heat transfer for various applications, enhancing the performance of electronic components. With a thermal resistance of 0.205°C/W, it effectively manages heat, allowing systems to operate within safe temperature limits.Operating in extreme temperatures between -50°C and 240°C, this thermal paste is suitable for a wide range of uses, from low-temperature applications to high-performance systems. Compliance with ISO 9002 and RoHS standards ensures safety and quality, making it a reliable choice for thermal management in electronic devices.
- Keep your computer's CPU cool
- Practical syringe for easy application
- Thermal compound for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
