1. Dual socket P (LGA 3647) supports
Intel® Xeon® Scalable Processors,
Dual UPI up to 10.4GT/s
2. Up to 1.5TB ECC 3DS LRDIMM, up to
DDR4-2666MHz; 12 DIMM slots
3. 2 PCI-E 3.0 x16 (FHHL) slots,
1 PCI-E 3.0 x8 (LP) slot,
1 PCI-E 3.0 x16 for Add-on-Module,
1 PCI-E M.2 SSD slot
4. 8 Hot-swap 2.5" SAS/SATA
drive bays
5. Optional 1 slim DVD-ROM drive bay
6. 2 1GbE LAN ports via Intel® X722
7. 1 VGA, 4 USB 3.0 (rear)
8. 2 SuperDOM (Disk on Module) ports
9. 600W Multi Output Power Supply,
Platinum Level High-efficiency